TSMC reportedly considering building advanced packaging plant in US amid pressure from Trump
President Trump wants to bring advanced semiconductor production from Taiwan back to America.
Now there may be some progress in that desire, thanks to the only $1 trillion Taiwanese publicly traded company.
According to the Taipei-based Economic Daily News (sans sources), TSMC is considering building an advanced packaging plant in the United States. These discussions come as the company “is facing pressure from the new White House administration and has planned to adjust its factory plans in the United States.”
About that pressure: the semiconductor industry is wrestling with the notion that it might not be getting all the funds it expected from the CHIPS Act, which was passed by the previous administration, as some of the conditions for financing may be in conflict with executive orders signed by Trump.
The president has bemoaned America’s loss of leadership in producing the most advanced semiconductors.
“They left us, and they went to Taiwan,” Trump said Monday. “We want them to come back, and we don’t want to give them billions of dollars.”
(If you’re interested in a deep dive on the history of semiconductor production and how they’ve come to be made where they’re made, I highly recommend this paper.)