Intel reportedly nearing a packaging deal with memory giant SK Hynix
Intel may be on the verge of securing South Korean memory giant SK Hynix as a major customer.
According to ZDNet Korea, SK Hynix is considering using Intel’s technology for packaging its high-bandwidth memory chips together with logic dies.
If realized, this would see Intel build on momentum from reports just days ago in which Apple reached a preliminary agreement for the chipmaker to manufacture Apple silicon in America.
The AI boom has been turning around Intel’s once struggling foundry business, and CPUs (a longtime strength) are experiencing a surge in demand thanks to the compute needs of AI agents.
Supported by the US government (which holds a 10% stake in Intel), the company’s expanding foundry footprint offers a domestic alternative for data center build-outs in a world where floor space is a major constraint.
Shares of Intel have risen over 220% year to date.